Ultra-High Power Density Full-SiC Boost Converter Enabled by Advanced 3D-Printing Techniques
Wienhausen, Arne Hendrik; Sewergin, Alexander; de Doncker, Rik W.
Piscataway, NJ : IEEE (2019)
Contribution to a book, Contribution to a conference proceedings
In: APEC 2019 : Thirty-Fourth Annual IEEE Applied Power Electronics Conference : March 17-21, 2019, Anaheim, California / the sponsors: Power Sources Manufacturers Association, IEEE Power Electronics Society, IEEE Industry Applications Society
Page(s)/Article-Nr.: 1281-1288
Institutions
- Chair of Power Electronics and Electrical Drives [614510]
- Institute of Power Electronics and Electrical Drives [614500]
Identifier
- DOI: 10.1109/APEC.2019.8721856
- RWTH PUBLICATIONS: RWTH-2019-07271