Spatially-Varying Electrothermal Impedance Analysis for Designing Power Semiconductor Converter Systems

Polom, Timothy A. (Corresponding author); van der Broeck, Christoph Henrik (Corresponding author); de Doncker, Rik W.; Lorenz, Robert D.

Piscataway, NJ : IEEE (2019)
Buchbeitrag, Beitrag zu einem Tagungsband

In: Proceedings of the Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm 2019 : May 28-31, 2019, the Cosmopolitan of Las Vegas, Las Vegas, NV USA / IEEE, IEEE Electronics and Packaging Society
Seite(n)/Artikel-Nr.: 117-126