Comparison of High Performance Cooling Concepts for SiC Power Modules

Sewergin, Alexander (Corresponding author); Stippich, Alexander; Wienhausen, Arne Hendrik; de Doncker, Rik W.

Piscataway, NJ : IEEE (2019)
Buchbeitrag, Beitrag zu einem Tagungsband

In: APEC 2019 : Thirty-Fourth Annual IEEE Applied Power Electronics Conference : March 17-21, 2019, Anaheim, California / the sponsors: Power Sources Manufacturers Association, IEEE Power Electronics Society, IEEE Industry Applications Society
Seite(n)/Artikel-Nr.: 2822-2825