Integrated Cooling Channels in Direct Bonded Copper Substrates for Silicon Carbide MOSFETs

• Integrierte Kühlkanäle in Direct Bonded Copper Substraten für Siliziumkarbid MOSFETs

Stippich, Alexander (Corresponding author); Battefeld, Maximilian; de Doncker, Rik W.

Nuremberg : VDE (2018)
Buchbeitrag

In: PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Seite(n)/Artikel-Nr.: 1400-1407