Compact High Temperature Package with Smart Size Optimized Gate Drive Unit for Assembling the Dual-ICT

Butschen, Thomas; Wang, Zhan; Kaymak, Murat; de Doncker, Rik W.

Piscataway, NJ : IEEE service center (2012)
Buchbeitrag, Beitrag zu einem Tagungsband

In: 2012 IEEE Energy Conversion Congress and Exposition (ECCE 2012) : Raleigh, North Carolina, USA, 15 - 20 September 2012 / [sponsored by the IEEE Power Electronics and Industry Applications Societies]
Seite(n)/Artikel-Nr.: 464-470

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